Materials for Electronics, Aerospace and Automotive Industry
Analytical techniques available
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Comprehensive advisory
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Materials selection and
development
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Contract R & D
- Structure / property relationsship e.g. cure mode of thermosets
- Surface characterisation
- Quality control / Failure analysis
- Interface-phenomena e.g. surface treatment, coupling agent
- Contaminations ( cleaning, release agents, surfactants )
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Thermal: DSC, MDSC, TMA, TGA
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FTIR : ATR, Microscope, Photoacoustic
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Dynamic mechanical and dielectric spectroscopy:
DMTA, DETA
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NMR, GPC ( in cooperation )
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Surface: SEM, AFM, TOFSIMS, ESCA ( in coop.)
Formulation and compounding of epoxy adhesives
and encapsulants:
toughened / conducting ( thermal &
electrical) / flame retard. UL 94 –V0